How Long to Read Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems

How Long Does it Take to Read Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems?

It takes the average reader to read Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems by Wayne Harvey Woods

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Description

The increasing performance and decreasing size of electronic systems have forced proper design and modeling of chip and packaging interconnect architectures to the center stage of successful system development. Electromagnetic coupling and loss mechanisms present in the package and chip interconnect become performance bottlenecks at the larger signal frequencies and higher interconnect densities of future electronic systems. The swelling power consumption and high transient frequencies of high-performance microprocessors consume more design time and chip and packaging wiring resources. In compact mixed-signal environments, electromagnetic noise coupling between sensitive analog circuitry and interconnect and their digital counterparts must be addressed with layout methodologies, modeling, and shielding techniques in the initial on-chip and packaging design stages. Problems associated with interconnect signal integrity, electromagnetic interference and compatibility, simultaneous switching noise, DC loss, and limited wiring and chip connection resources must be solved to maintain the trend of increasing electronic system performance. This dissertation presents research efforts aimed at circumventing future interconnect design bottlenecks in three areas. First, a packaging noise reduction structure is proposed and simulations, models, and measurements of the packaging noise suppression structure are presented. Second, a novel power and ground distribution architecture for high-performance microprocessors is proposed and analyzed. Lastly, the development of a tool for modeling the interaction of interconnect lines with the silicon substrate in high-frequency mixed-signal environments is explored.

How long is Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems?

Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems by Wayne Harvey Woods is 0 pages long, and a total of 0 words.

This makes it 0% the length of the average book. It also has 0% more words than the average book.

How Long Does it Take to Read Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems Aloud?

The average oral reading speed is 183 words per minute. This means it takes to read Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems aloud.

What Reading Level is Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems?

Design, Modeling, Simulation, and Measurement of IC and Package Structures for Noise Management and Power Distribution in High-performance Electronic Systems is suitable for students ages 2 and up.

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