It takes the average reader 7 hours and 50 minutes to read Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines by Michael Pecht
Assuming a reading speed of 250 words per minute. Learn more
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage...
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines by Michael Pecht is 470 pages long, and a total of 117,500 words.
This makes it 159% the length of the average book. It also has 144% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 10 hours and 42 minutes to read Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines aloud.
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines is suitable for students ages 12 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines by Michael Pecht is sold by several retailers and bookshops. However, Read Time works with Amazon to provide an easier way to purchase books.
To buy Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines by Michael Pecht on Amazon click the button below.
Buy Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines on Amazon