How Long to Read Modeling and Simulation for Microelectronic Packaging Assembly

How Long Does it Take to Read Modeling and Simulation for Microelectronic Packaging Assembly?

It takes the average reader 10 hours to read Modeling and Simulation for Microelectronic Packaging Assembly by Shen Liu

Assuming a reading speed of 250 words per minute. Learn more

Description

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

How long is Modeling and Simulation for Microelectronic Packaging Assembly?

Modeling and Simulation for Microelectronic Packaging Assembly by Shen Liu is 586 pages long, and a total of 150,016 words.

This makes it 198% the length of the average book. It also has 183% more words than the average book.

How Long Does it Take to Read Modeling and Simulation for Microelectronic Packaging Assembly Aloud?

The average oral reading speed is 183 words per minute. This means it takes 13 hours and 39 minutes to read Modeling and Simulation for Microelectronic Packaging Assembly aloud.

What Reading Level is Modeling and Simulation for Microelectronic Packaging Assembly?

Modeling and Simulation for Microelectronic Packaging Assembly is suitable for students ages 12 and up.

Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.

When deciding what to show young students always use your best judgement and consult a professional.

Where Can I Buy Modeling and Simulation for Microelectronic Packaging Assembly?

Modeling and Simulation for Microelectronic Packaging Assembly by Shen Liu is sold by several retailers and bookshops. However, Read Time works with Amazon to provide an easier way to purchase books.

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