It takes the average reader 4 hours and 54 minutes to read TSV 3D RF Integration by Shenglin Ma
Assuming a reading speed of 250 words per minute. Learn more
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including...
TSV 3D RF Integration by Shenglin Ma is 292 pages long, and a total of 73,584 words.
This makes it 99% the length of the average book. It also has 90% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 6 hours and 42 minutes to read TSV 3D RF Integration aloud.
TSV 3D RF Integration is suitable for students ages 12 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
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