It takes the average reader 9 hours and 12 minutes to read 3D IC Stacking Technology by Banqiu Wu
Assuming a reading speed of 250 words per minute. Learn more
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
3D IC Stacking Technology by Banqiu Wu is 544 pages long, and a total of 138,176 words.
This makes it 184% the length of the average book. It also has 169% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 12 hours and 35 minutes to read 3D IC Stacking Technology aloud.
3D IC Stacking Technology is suitable for students ages 12 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
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