It takes the average reader 1 hour and 6 minutes to read Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers by Christopher Kyle Gregory Doran
Assuming a reading speed of 250 words per minute. Learn more
Flexibility is a desirable attribute for many large-area semiconductor devices such as light-emitting diodes, photodetectors, and solar cells. Plastic substrates have received considerable attention for flexible devices due to their combination of chemical resistance, toughness, and low cost. However, in cases where monocrystalline semiconductor material is desired, integrating the semiconductor with the plastic in a manner that allows backside conduction can be challenging due to processing constraints of the plastic. This thesis discusses the integration of flexible single-crystal semiconductors with plastic substrates utilizing conductive intermediary adhesive materials. Various methods are discussed for the attainment of the thin semiconductor layer to be bonded. In particular, backside etching is evaluated in the isolation of thin GaAsP and Si for double and single-flip processes, and commercially-available ultra-thin Si wafers are evaluated for pre-thinned diode fabrication. Silver colloid-filled epoxy and double-sided tape are studied for the integration of these materials to polyethylene naphthalate substrates, and compared to selected metal intermediary bonding schemes. Fabricated and evaluated are thin flexible light-emitting diodes and Si-Pd Schottky diodes. Additionally, an accelerated lifetime test is applied to the adhesives to estimate their long-term stability. Finally, regular segmentation is investigated as a method to introduce effective flexibility to thick wafers. The technique is applied to ~400[mu]m-thick InP-based multiple-quantum-well solar cells, and the effects of the segmentation are analyzed.
Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers by Christopher Kyle Gregory Doran is 65 pages long, and a total of 16,575 words.
This makes it 22% the length of the average book. It also has 20% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 1 hour and 30 minutes to read Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers aloud.
Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers is suitable for students ages 8 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers by Christopher Kyle Gregory Doran is sold by several retailers and bookshops. However, Read Time works with Amazon to provide an easier way to purchase books.
To buy Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers by Christopher Kyle Gregory Doran on Amazon click the button below.
Buy Integration of Single-crystal Devices with Flexible Substrates Using Conductive Adhesive Layers on Amazon