How Long to Read Interconnect Reliability in Advanced Memory Device Packaging

How Long Does it Take to Read Interconnect Reliability in Advanced Memory Device Packaging?

It takes the average reader 3 hours and 45 minutes to read Interconnect Reliability in Advanced Memory Device Packaging by Chong Leong, Gan

Assuming a reading speed of 250 words per minute. Learn more

Description

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

How long is Interconnect Reliability in Advanced Memory Device Packaging?

Interconnect Reliability in Advanced Memory Device Packaging by Chong Leong, Gan is 223 pages long, and a total of 56,419 words.

This makes it 75% the length of the average book. It also has 69% more words than the average book.

How Long Does it Take to Read Interconnect Reliability in Advanced Memory Device Packaging Aloud?

The average oral reading speed is 183 words per minute. This means it takes 5 hours and 8 minutes to read Interconnect Reliability in Advanced Memory Device Packaging aloud.

What Reading Level is Interconnect Reliability in Advanced Memory Device Packaging?

Interconnect Reliability in Advanced Memory Device Packaging is suitable for students ages 12 and up.

Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.

When deciding what to show young students always use your best judgement and consult a professional.

Where Can I Buy Interconnect Reliability in Advanced Memory Device Packaging?

Interconnect Reliability in Advanced Memory Device Packaging by Chong Leong, Gan is sold by several retailers and bookshops. However, Read Time works with Amazon to provide an easier way to purchase books.

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