It takes the average reader 8 hours to read 3D IC Integration and Packaging by John H. Lau
Assuming a reading speed of 250 words per minute. Learn more
A comprehensive guide to 3D IC integration and packaging technology 3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding,...
3D IC Integration and Packaging by John H. Lau is 480 pages long, and a total of 120,000 words.
This makes it 162% the length of the average book. It also has 147% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 10 hours and 55 minutes to read 3D IC Integration and Packaging aloud.
3D IC Integration and Packaging is suitable for students ages 12 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
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