How Long to Read Through-Silicon Vias for 3D Integration

How Long Does it Take to Read Through-Silicon Vias for 3D Integration?

It takes the average reader 8 hours and 36 minutes to read Through-Silicon Vias for 3D Integration by John Lau

Assuming a reading speed of 250 words per minute. Learn more

Description

A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals...

How long is Through-Silicon Vias for 3D Integration?

Through-Silicon Vias for 3D Integration by John Lau is 512 pages long, and a total of 129,024 words.

This makes it 173% the length of the average book. It also has 158% more words than the average book.

How Long Does it Take to Read Through-Silicon Vias for 3D Integration Aloud?

The average oral reading speed is 183 words per minute. This means it takes 11 hours and 45 minutes to read Through-Silicon Vias for 3D Integration aloud.

What Reading Level is Through-Silicon Vias for 3D Integration?

Through-Silicon Vias for 3D Integration is suitable for students ages 12 and up.

Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.

When deciding what to show young students always use your best judgement and consult a professional.

Where Can I Buy Through-Silicon Vias for 3D Integration?

Through-Silicon Vias for 3D Integration by John Lau is sold by several retailers and bookshops. However, Read Time works with Amazon to provide an easier way to purchase books.

To buy Through-Silicon Vias for 3D Integration by John Lau on Amazon click the button below.