It takes the average reader 8 hours and 33 minutes to read Semiconductor Advanced Packaging by John H. Lau
Assuming a reading speed of 250 words per minute. Learn more
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high...
Semiconductor Advanced Packaging by John H. Lau is 498 pages long, and a total of 128,484 words.
This makes it 168% the length of the average book. It also has 157% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 11 hours and 42 minutes to read Semiconductor Advanced Packaging aloud.
Semiconductor Advanced Packaging is suitable for students ages 12 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
Semiconductor Advanced Packaging by John H. Lau is sold by several retailers and bookshops. However, Read Time works with Amazon to provide an easier way to purchase books.
To buy Semiconductor Advanced Packaging by John H. Lau on Amazon click the button below.
Buy Semiconductor Advanced Packaging on Amazon