It takes the average reader 5 hours and 6 minutes to read Fan-Out Wafer-Level Packaging by John H. Lau
Assuming a reading speed of 250 words per minute. Learn more
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Appleās iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers,...
Fan-Out Wafer-Level Packaging by John H. Lau is 303 pages long, and a total of 76,659 words.
This makes it 102% the length of the average book. It also has 94% more words than the average book.
The average oral reading speed is 183 words per minute. This means it takes 6 hours and 58 minutes to read Fan-Out Wafer-Level Packaging aloud.
Fan-Out Wafer-Level Packaging is suitable for students ages 12 and up.
Note that there may be other factors that effect this rating besides length that are not factored in on this page. This may include things like complex language or sensitive topics not suitable for students of certain ages.
When deciding what to show young students always use your best judgement and consult a professional.
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